Home > Products > Decapsulation Machine > MIS > Auto Decap Auto Decap Products X Ray Imaging & AnalysisYxlonCougar EVOCheetah EVOFF20 CTFF35 CTFF70 CLXRF AnalysisBowmanG Series XRFB Series XRFP Series XRFO Series XRFM Series XRFL Series XRFIndustrial Light & Confocal MicroscopeCarl ZeissStemi 305Stemi 508AxioscopeAxio Imager 2Axio Imager VarioSmartzoom 5Smartproof 5Sample PreparationQuorumMini Sputter Coater SC7620Q150R Plus - Rotary Pumped CoaterExtecLabpol 8-12 M advanced PolisherLabpol 8-12 S advanced PolisherLabpol 12 - Advanced Grinder/ PolisherLabpol Duo 8 PolisherCutting Machine - Labcut 150Cutting Machine - Labcut 300GatanPECS IIIlion IIPIPS IIDimple GrinderSolarus II Plasma CleanerTEM Sample Preparation - Cross Section KitDecapsulation MachineMISLaser DecapWet EtchMill EtchAuto DecapProbe StationEverbeingEB SeriesBD SeriesC series - Starter Probe StationC2 Mini Probe StationFour Point ProbeHot ChuckFailure Analysis Fault Isolation Microscope SystemQFIEmmi™ Photoemission MicroscopyXIVA™ LSIM ( Laser Signal Injection Microscopy)Thermal HS Infrared Hot Spot Detection MicroscopyReliability Testing SystemReliability TestingESD/Latch-up/TLPThermo ScientificMK4MK2MK1Orion 3CelestronPegasus Function & Features All the works necessary for decap are realized through Auto Decaper. The automated robot decapsulation system that has been developed first in the world. The functions of milling, etching, heating, acetone cleaning, drying, ultrasonic cleaning, and vision inspection available. Protecting workers from harmful chemicals. Minimizing damage etching of copper in the case of copper wired IC. Minimizing the damage on the ball or the tape at the bottom of a package. Fast, safe, and efficient decapsulation. Protecting workers and equipment through the built-in exhaust system. The functions of checking decap results through enlarged clear images, saving images, and printing images available. Dual heating (MIS-specialized technology). More precise, faster, and safer decap possible. Easy control through convenient GUI. Repetitions made simple using recipe files. Consumable gaskets are unnecessary and very small amount of etching chemical is used. Expanded decap possibility for various sizes and patterns of packages. Minimal maintenance and repair costs, and long lifecycles. Decapped IC Samples Product Details Specification Item Description Dimension 1420(W) x 875(D) x 1720(H) mm Weight Approx. 250 kg Procedure Milling, Etching, Heating, Cleaning, Ultrasonic Cleaning, Inspection Handling IC Size 2x2 mm ~ 50x50 mm (Minimum Milling Depth : Approx. 0.01 mm) Etchant Fuming Nitric Acid, Sulfuric Acid, Fuming Sulfuric Acid Cleaning Solution Acetone Heating Temperature 1. Beam Heater : (Room Temp.)~ 400 °C 2. Jig Heater : (Room Temp.)~ 250 °C Free Control by Dual Heating System Ultrasonic 38~40 KHz Process Time Milling: 1~2 min., Etching~Cleaning: 3~15 min. (Average Time) Utility Roted Voltage : AC 220V/110V, 1 Phase Roted Current : 15A Roted Frequency : 50 ~ 60 Hz Air Pressure : 6kg/㎠ (bar) Fume Exhaust Line De-Ionized Water Supply / Drain Program User Interface : Window Based Graphical User Interface Applications BGA, PBGA, BOC, DIP, QFP, CSP, SCSP, MCM, TSOP and etc.