Function & Features

• Automatic chemical decapsulation equipment 
• The functions of etching, heating, acetone cleaning, and drying available 
• Protecting workers from harmful chemicals 
• Minimizing damage etching of copper in the case of copper wired IC 
• Minimizing the damage on the ball or the tape at the bottom of a package 
• Fast, safe, and efficient decapsulation
• Dual heating (MIS-specialized technology) 
• More precise, faster, and safer decap possible. 
• Repetitions made simple using recipe files 
• Consumable gaskets are unnecessary and very small amount of etching chemical is used. 
• Expanded decap possibility for various sizes and patterns of packages 
• Minimal maintenance and repair costs, and long lifecycles
• LED Chip Package Decap available