CA20
CA20 Submicron 3D X-Ray for Advanced Packaging
Whether you need the highest quality images to inspect your parts in a Lab/R&D environment, or you require a fully-automated solution that easily fits into your existing production process, the CA20 is available in a variety of configurations to suit your needs.
Highlights
- Designed to cover the entire semiconductor manufacturing chain, from wafer processing to packaged chips
- Available with fully automated operation for seamless integration into your fab
- AI-based data analysis and advanced software ensures fast, accurate defect classification to resolve systematic issues and maximize yield
- Non-destructive technology for three-dimensional insights into solder bumps or TSVs within minutes
- Repeatable results through reliable and accurate technology, designed to support a stable inspection routine
- Cleanroom ready, with conditions within the cabinet comparable to ISO Class 3
Find out more via the links below:
https://comet.tech/yxlon/products/ca20