CA20

CA20 Submicron 3D X-Ray for Advanced Packaging

Whether you need the highest quality images to inspect your parts in a Lab/R&D environment, or you require a fully-automated solution that easily fits into your existing production process, the CA20 is available in a variety of configurations to suit your needs.

Highlights

  • Designed to cover the entire semiconductor manufacturing chain, from wafer processing to packaged chips
  • Available with fully automated operation for seamless integration into your fab
  • AI-based data analysis and advanced software ensures fast, accurate defect classification to resolve systematic issues and maximize yield
  • Non-destructive technology for three-dimensional insights into solder bumps or TSVs within minutes
  • Repeatable results through reliable and accurate technology, designed to support a stable inspection routine
  • Cleanroom ready, with conditions within the cabinet comparable to ISO Class 3

Find out more via the links below:

https://comet.tech/yxlon/products/ca20

 

 

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