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Fintexs Technologies Sdn Bhd
Mr. Ricky Lim
Ms. Chew
Tel : 04 - 656 6648


High Accuracy Cleaving (HAC) System

LatticeGear was founded on the principle that materials cleaving should be easy and fast, without the high cost of automation. So we’ve developed solutions ranging from high accuracy cleaving (HAC) systems to complete kits that take the guesswork out of selecting supplies for your specific use case. Whether you are working with wafers, die or pieces, we work with you to select a solution that best optimizes your sample preparation work-flow. Visit to view our resource library with publications and videos.

High Accuracy Cleaving (HAC) System LatticeGear LatticeAx™ 420 LatticeGear LatticeAx 220 LatticeGear LatticeAx 120

High Accuracy Cleaving (HAC) System Back To Top

Go from wafers to analysis-ready samples in minutes quickly, easily, repeatedly, and with virtually no added costs of operation.


  • No service contract
  • No annual periodic maintenance
  • Easy for user to maintain
  • Utilizes 1 - 2 diamond indenters per year (extreme low cost/cleave)

LatticeGear LatticeAx™ 420 Back To Top

Thermo Scientific MK2


  • 10 µm targeting accuracy
  • 3 µm imaging resolution
  • X-Y-R stages, microscope and color CCD camera
  • Fiber-optic lighting

LatticeGear LatticeAx 220 Back To Top

Thermo Scientific MK1


  • 20 µm targeting accuracy
  • 20 µm imaging resolution
  • Integrated USB microscope and camera

LatticeGear LatticeAx 120 Back To Top

Thermo Scientific MK1


  • The LatticeAx Base Platform
  • Combine with your own optical microscope for improved accuracy

Learn more at